Small and efficient packages

Amkor’s ExposedPad (ePad) TSSOP, MSOP, SOIC & SSOP are leadframe based, plastic encapsulated packages suited for applications requiring optimal thermal performance, compressed body size and tightened lead pitch. ePadTSSOP, MSOP,SOIC&SSOPoffer a substantial increase in heat dissipation, yield a significant reduction in size and provide value-added, low-cost solutions for a wide range of applications.


  • Cu wire interconnect for the lowest cost
  • Standard JEDEC package outlines
  • Multi-die production capability
  • Turnkeytest services, including strip test options
  • ExposedPad configuration for increased thermal efficiency
  • Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)
  • Green materials are standard – Pb-free and RoHS compliant
  • Stealth dicing (narrow saw streets)
  • Larger/higher density leadframe strips
  • Leadframe roughening for improved MSL capability


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