Small and efficient packages
Amkor’s ExposedPad (ePad) TSSOP, MSOP, SOIC & SSOP are leadframe based, plastic encapsulated packages suited for applications requiring optimal thermal performance, compressed body size and tightened lead pitch. ePadTSSOP, MSOP,SOIC&SSOPoffer a substantial increase in heat dissipation, yield a significant reduction in size and provide value-added, low-cost solutions for a wide range of applications.
- Cu wire interconnect for the lowest cost
- Standard JEDEC package outlines
- Multi-die production capability
- Turnkeytest services, including strip test options
- ExposedPad configuration for increased thermal efficiency
- Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)
- Green materials are standard – Pb-free and RoHS compliant
- Stealth dicing (narrow saw streets)
- Larger/higher density leadframe strips
- Leadframe roughening for improved MSL capability
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