帮助我们改变科技的面貌

安科致力于在中国的长期制造业扩张。我们正在寻找充满活力的专业人士谁融合创造力和经验与远见和合作。我们独特的企业文化体现在我们的主要宗旨上:用我们集体的才能和精力为我们的客户、公司和人民实现繁荣和成就。Amkor Technology的使命是通过客户满意度、领先技术和财务绩效,成为世界一流的半导体组装和测试服务公司。bob体彩bob软件

Amkor Technology is an Equal Opportunity Employer.

就业机会

业务发展经理


Duties & Responsibilities:

  • Develop new biz from emerging Mobile, Communication (4G/5G) or Automotive markets in Greater China
  • Define & execute growth strategy
  • 开发市场情报和OSAT动态报告
  • Be contact window of Greater China, interface to HQ BU and support field Sales team

资格:

  • 电气工程或材料科学学士/硕士学位
  • More than 5 years of Marketing/Sales/FAE/PM working experience
  • 熟悉中国移动/通信/汽车生态系统/客户群
  • bob软件有半导体IDM/IC无晶圆厂/OSAT背景者优先
  • 良好的英语水平

工艺工程师


Duties & Responsibilities:

  • Sustain and/or optimizing process-yields and process-quality of the products through process improvement programs (SPC) and process monitoring (process capability-SPC) on production-lines. This includes data collection, analysis, and charting of process monitoring
  • Responsible in evaluating, establishing, qualifying, and implementing of manufacturing process to production (due to changes in processes, materials, equipment & tooling)
  • Qualify new materials, tooling, equipment ,new devices/packages and generation of specification, work-instruction, and procedures for production. This include BOM verifications and validations
  • Analyze and disposition of abnormality or low yield lots. This also includes disposition of questionable (MRB) materials
  • Recommend, evaluate and procure new equipment/material as part of cost reduction programs enhancing company’s competitiveness through higher output and lower cost
  • 支持和解决生产线相关问题

Requirements:

  • Preferably Degree in Electrical/Electronics, Mechanical, Chemical, Physics and above
  • >1 year experienced process engineer from semiconductor factory
  • Knowledge of quality tools and problem-solving skills, such as ISO9001 & IATF16949, SPC, MSA, FMEA, APQP, Control plan, PPAP, 8D, QC 7 tools, DOE, FA & Rel, MRB
  • CET–4, basic knowledge of 6-Sigma

感兴趣的候选人可以把简历寄到ATCRecruit@www.chenyuhi.com

测试开发工程师


Duties & Responsibilities:

  • Develop test solution on the Flex/J750/T2000/V93000 (includes VB/C++ programming) for Digital, Mixed Signal, High Speed and RF application devices
  • Perform test program optimization /correlation to reduce COT and increase fault coverage
  • 向客户提供解决方案规划方面的专业技术。需要具备快速理解新概念的能力,并将这种理解应用于利用现有ATE工具的可行解决方案
  • 执行DUT板设计,为客户提供DUT板设计咨询
  • Be Interface and communicate with account teams, relevant divisions, sales force and customers to ensure project deliveries meet specification and customer expectation

资格:

  • 电子工程、微电子、射频/微波工程或相关专业本科学历。需要硕士学位
  • 至少3年以上ATE系统测试开发经验
  • VB、C/C++编程技巧
  • 流利的英语听说读写能力
  • Proven Project Management skills
  • 积极主动,自律,积极主动
  • Good communication & strong team contributor

感兴趣的候选人可以把简历寄到ATCRecruit@www.chenyuhi.com

TPM(深圳)技术项目经理


Duties & Responsibilities:

  • Coordinate customer qualifications of Amkor Technology factories and services
  • 协调已接受的客户特定技术方案或要求的实施
  • 管理日常战术技术问题
  • 发展和维护与关键客户技术人员的关系
  • Promoting Amkor Technology capabilities, processes, and services
  • Supporting the Account Manager related approval process
  • Managing the resolution of customer specific manufacturing process, material quality or reliability problems
  • Collecting and communicating our customer’s long-range technology roadmaps and providing the information to the appropriate groups
  • Work with the Account Managers to drive the company to support those future customer requirements that are in line with
  • Amkor strategic imperatives
  • 协助与工厂、产品组协调客户审核/访问
  • 提高个人对半导体技术、制造和工艺的认识bob软件

Travel Required:

  • Domestic 30% International 5%

资格:

  • University degree in material, electricity, mechanics, physics or electronics related
  • More than 7 years’ experience in IC or Fab industry, especially familiar with FCBGA will be a plus
  • 有设计或研发经验
  • 有项目管理经验
  • Have customer quality issue release experience

感兴趣的候选人可以把简历寄到ATCRecruit@www.chenyuhi.com

设计工程师


工作总结:

负责完成包装设计(引线框架/层压板/WLCSP和凸点产品)and associated support documentation. To partake in daily communications with customers, factory personnel, suppliers, and design/characterization team members to ensure the successful execution and completion of design projects and R&D support programs.

Duties & Responsibilities:

  • 负责完成包装设计(引线框架/层压板/WLCSP和凸点产品)
  • Responsible for associated support documentation
  • 参与与客户、工厂人员、供应商和设计/特性团队成员的日常沟通,确保设计项目和研发支持计划的成功执行和完成
  • 主管交办的其他工作

Travel Required:

  • 国内5%国际0%

资格:

  • 本科学历,工程相关专业
  • More than one year working in semiconductor process field
  • Know about the relative basic semiconductor package procedure
  • 计算机操作技能和设计工具
  • Good verbal and written English communications are required for interactions with external and internal customers

Become Part of the Team

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What we offer

13th bonus

Quarterly bonus

补充医疗保险

Canteen

Dormitory

Shuttle bus lines covering all areas of Shanghai

Birthday gift

Holiday gifts

Career path and promotion based on performance and competency

量身定做的培训计划

Job rotation

Overseas training opportunities

员工援助计划

更高的加班工资、绩效津贴和轮班津贴

Retention program for key talents

最佳员工海外旅行