Power packaging for medium power applications, designed for low on-resistance and high-speed switching MOSFETs

The PQFN (Power Quad Flat No-lead) is a highly efficient space saving package designed for a wide range of higher power applications. A “Smart Power” option in today’s power electronic world, the PQFN is a step above the standard low-power sawn QFN package, while being more flexible (IC control die integrated designs) than other power discrete packages.

Features

  • Space-saving designs ranging from 3 x 3 mm to 8 x 8 mm body size
  • Very low parasitics and inductances resulting in world-class package level RDS(on)
  • Outstanding EMI behavior and excellent thermal performance
  • Numerous multi-die, multi-clip with wire variations available
  • Capable of supporting numerous GaN applications/solutions
  • Pb-free plating and halogen-free mold compound
  • Wettable flank option available and well suited to the automotive market
  • Package available with dual exposed heatsink options

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