Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Amkor Technology is a proud contributor to the new book “Advances in Embedded and Fan-Out Wafer Level Packaging Technologies”, edited by Beth Keser and Steffen Kroehnert, published by Wiley & IEEE PRESS (528 pages).

In addition to co-editing the new book “Advances in Embedded and
Fan-Out Wafer Level Packaging Technologies”, Amkor Technology’s team members contributed to three of the chapters:

Chapter 3 – “Embedded Wafer-Level Ball Grid Array (eWLB) Packaging Technology Platform“, Thorsten Meyer, Infineon Technologies AG, Germany and Steffen Kroehnert, Amkor Technology, Inc.

Chapter 7 – “SWIFT^®Semiconductor Packaging Technology“, Ron Huemoeller and Curtis Zwenger, Amkor Technology, Inc.

Chapter 11 – “Embedded Die in Substrate (Panel-Level) Packaging Technology“, Tomoko Takahashi and Akio Katsumata, J-Devices Corp.
(An Amkor Company)