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17th International Conference on Device Packaging

Amkor Technology invites you to join us at the 17th International Conference on Device Packaging Virtual Event on April 12-15, 2021.

Amkor is a proud Gold Hosting Partner and will be presenting the following:

“Heterogeneous IC Packaging Options for Optimizing Performance and Cost”
Mike Kelly, VP – Adv Package & Technology Integration at Amkor Technology

“Chip Scale Power Transistor Packaging”
肖恩·鲍尔斯-主流先进Packag副总裁e Integration at Amkor Technology

“Power Packaging Trends in Emerging 48V Ecosystem”
Dr. Ajay Kumar Sattu, Sr Manager, Automotive Product Marketing at Amkor Technology

“Design of Subsystem Module Package for Power Distribution Network”
HoJeong Lim, Director – IC Package Design at Amkor Technology Korea

“High Thermal Performance TIM (Thermal Interface Material) for lidded FCBGA Products”
Young Do Kweon, Director – R&D at Amkor Technology Korea

“Challenges for Achieving Automotive Grade 1/0 Reliability in FCBGA and fcCSP Packages”
Knowlton Olmstead, Sr. Engineer – Memory Product Development at Amkor Technology

“Chip Package Bumping on Wafer-level for RDL First Fan-out Wafer”
Anshuma Pathak, Pac Tech Packaging Technologies GmbH and Felandorio Fernandes, Sr. Manager – R&D at Amkor Technology

IMAPS DPC is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.