丹尼尔·廖

林亚太区业务主席

廖先生被任命为公司的董事会在2019年廖先生的六月一直在Lam Research的,半导体处理设备公司的高级管理人员,自1993年以来,目前担任(林亚太区业务主席,中国台湾和bob软件Southeast Asia regions), where he has been a major contributor to the global product development, strategic planning, growth and success of Lam’s multi-billion dollar Asia Pacific business. Prior to joining Lam, Mr. Liao held engineering management and technology leadership positions at Integrated Device Technology in Santa Clara from 1988 to 1993 and Intel Corporation in Livermore and Santa Clara from 1984 to 1988. Mr. Liao holds a Bachelor’s degree in Electrical Engineering from National Cheng Kung University in Taiwan, and a Master’s degree in Electrical Engineering and Applied Physics from Case Western Reserve University.