ISES Advanced Packaging – The Titans Webinar

Amkor Technology is a proud sponsor of the upcomingAdvanced Packaging – The Titans Webinaron May 6, 2021, at 07:00 – 10:00 am PST US.

This International Semiconductor Executive Summit (ISES) member-exclusive webinar will consist of the following high-level executive speakers:

Topic:“Advanced Packaging Architectures: Opportunities and Challenges”
Babak Sabi, Corporate VP, GM Assembly and Test Technology Development – Intel

Topic:“3DFabricTMfor System Level Innovation”
Marvin Liao, VP Advanced Packaging and Technology Services – TSMC

Topic:“Heterogeneous Integration: Chiplet packaging technology for Next-Generation Devices”
SeungwookYoon, Corporate VP/Head of Team of Package Technology Strategy and Planning, – Samsung Electronics

When:May 6, 2021 Where:VIRTUAL Location:VIRTUAL

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